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MP4601 数据表(PDF) 3 Page - Monolithic Power Systems |
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MP4601 数据表(HTML) 3 Page - Monolithic Power Systems |
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3 / 16 page ![]() MP4601 – WHITE LED DRIVER FOR LARGE SIZE TV BACKLIGHTING MP4601 Rev. 1.0 www.MonolithicPower.com 3 1/28/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2011 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP4601EF* TSSOP16-EP MP4601EF -20 °C to +85°C MP4601ES SOIC16 MP4601ES * For Tape & Reel, add suffix –Z (e.g. MP4601EF–Z); For RoHS Compliant Packaging, add suffix –LF (e.g. MP4601EF–LF–Z) PACKAGE REFERENCE ABSOLUTE MAXIMUM RATINGS (1) VVIN – VSS ........................................-0.3V to 85V VINGND – VSS.....................................-0.3V to 85V VSW – VSS ............................ -0.3V to VVIN + 0.3V VBST ...................................................... VSW + 6V VDGD – VSS .....................................-0.3V to +12V VSLOPE, VOCP – VSS ...........................-0.3V to +6V VOVP, VFB, VCOM, VFST – VSS .............-0.3V to +6V VFAULT, VDIM, VSYN, VEN – VINGND .......-0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) TSSOP16-EP............................................. 2.7W SOIC16 ...................................................... 1.6W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VVIN – VSS ................4.5V to 75V VDIM, VEN, VSYN – VINGND.........................0V to 5V Operating Junct. Temp (TJ)...... -40°C to +125°C Thermal Resistance (4) θJA θJC TSSOP16-EP ......................... 45 ...... 10... °C/W SOIC16.................................. 80 ...... 30... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device function is not guaranteed outside of the recommended operating conditions. 4) Measured on JESD5 1-7, 4-layer PCB. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 TOP VIEW EXPOSED PAD FOR TSSOP20F ONLY VIN OCP INGND EN SLOPE DIM SYN FST COMP VSS FB DGD OVP FAULT BST SW 1 2 3 4 16 15 14 13 12 11 10 9 5 6 7 8 TOP VIEW PIN 1 ID VIN INGND EN SLOPE DIM SYN FST FAULT OCP COMP VSS FB DGD OVP BST SW TSSOP16-EP SOIC16 |
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