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MP6002DN 数据表(PDF) 2 Page - Monolithic Power Systems

部件名 MP6002DN
功能描述  Monolithic Flyback/Forward DC-DC Converter
PDF  15 Pages
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制造商  MPS [Monolithic Power Systems]
网页  http://www.monolithicpower.com
标志 MPS - Monolithic Power Systems

MP6002DN 数据表(HTML) 2 Page - Monolithic Power Systems

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MP6002 – MONOLITHIC FLYBACK/FORWARD DC-DC CONVERTER
MP6002 Rev. 1.0
www.MonolithicPower.com
2
12/4/2013
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Temperature
MP6002DN
SOIC8E
MP6002DN
–40
C to +85C
* For Tape & Reel, add suffix –Z (eg. MP6002DN–Z).
For RoHS compliant packaging, add suffix –LF (eg. MP6002DN–LF–Z)
PACKAGE REFERENCE
GND
LINE
FB
COMP
SW
VIN
VCC
RT
1
2
3
4
8
7
6
5
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
(1)
VSW.............................................–0.5V to +180V
VIN .............................................–0.3V to +120V
All Other Pins..............................–0.3V to +6.5V
Continuous Power Dissipation
(TA = +25°C)
(2)
............................................................. 2.5W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage VCC ...........................4.5 V to 6V
Output Voltage VSW....................–0.5V to +150V
Input Voltage VIN .........................+10V to +100V
Operating Temperature............. –40
C to +85C
Thermal Resistance
(4)
θJA
θJC
SOIC8E (Exposed Pad) ..........50 ...... 10 ...
C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/ θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.



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