MPXV7002

Sensors

Freescale Semiconductor

5

Pressure

Figure 4. Output versus Pressure Differential

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing a gel die coat which

protects the die from harsh media.

The Pressure (P1) side may be identified by using the

following table:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. Small Outline Package Footprint

Differential Pressure (kPa)

5.0

4.0

3.0

2.0

1.0

0

02

TYPICAL

MIN

-2

-1

1

Transfer Function:

MAX

Part Number

Case Type

Pressure (P1)

Side Identifier

MPXV7002GC6U/GC6T1

482A-01

Side with Port Attached

MPXV7002GP

1369-01

Side with Port Attached

MPXV7002DP

1351-01

Side with Part Marking

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1