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ADP1607ACPZN-R7 数据表(PDF) 14 Page - Analog Devices |
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ADP1607ACPZN-R7 数据表(HTML) 14 Page - Analog Devices |
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14 / 16 page ![]() ADP1607 Data Sheet Rev. C | Page 14 of 16 LAYOUT GUIDELINES 1 2 3 4 5 6 EN GND SW VOUT FB VIN R1 0402 R2 0402 COUT 0402 CIN 0402 3.0mm ADP1607 TOP VIEW 7 EPAD L 2.2µH 0805 Figure 26. ADP1607 Recommended Layout Showing the Smallest Footprint For high efficiency, good regulation, and stability, a well- designed printed circuit board layout is required. Use the following guidelines when designing printed circuit boards (also see Figure 24 for a block diagram and Figure 2 for a pin configuration). • Keep the low ESR input capacitor, CIN, close to VIN and GND. This minimizes noise injected into the part from board parasitic inductance. • Keep the high current path from CIN through the L1 inductor to SW as short as possible. • Place the feedback resistors, R1 and R2, as close to FB as possible to prevent noise pickup. Connect the ground of the feedback network directly to an AGND plane that makes a Kelvin connection to the GND pin. • Avoid routing high impedance traces from feedback resistors near any node connected to SW or near the inductor to prevent radiated noise injection. • Keep the low ESR output capacitor, COUT, close to VOUT and GND. This minimizes noise injected into the part from board parasitic inductance. • Connect Pin 7 (EPAD) and GND to a large copper plane for proper heat dissipation. |
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