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MP8652 数据表(PDF) 11 Page - Monolithic Power Systems |
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MP8652 数据表(HTML) 11 Page - Monolithic Power Systems |
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11 / 14 page ![]() MP8652 – 15A, 14V, HIGH FREQUENCY STEP-DOWN WITH SYNCHRONOUS GATE DRIVER MP8652 Rev. 0.9 www.MonolithicPower.com 11 10/26/2009 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2009 MPS. All Rights Reserved. Table 3—Compensation Values for Typical Output Voltage / Capacitor VOUT (V) L1 (µH) C2, Ceramic (µF) C2, Poscap (µF)/ESR(mΩ) R3 (kΩ) C3 (nF) C6 (pF) 1.2 0.82 100X2 None 2.2 10 100 1.2 0.82 47 330/ 9/ 6.3V 5.49 3.3 560 1.8 0.82 47 330/ 9/ 6.3V 8.25 2.2 390 2.5 1.2 47 330/ 9/ 6.3V 11.5 1.5 270 3.3 1.3 47 220/ 18/ 6.3V 8.06 2.7 680 5 1.8 47 220/ 18/ 6.3V 16 1 100 To optimize the compensation components , the following procedure can be used. 1. Choose the compensation resistor (R3) to set the desired crossover frequency. Determine the R3 value by the following equation: FB OUT CS EA C V V G G f 2 C 2 3 R × × × × π = Where fC is the desired crossover frequency. 2. Choose the compensation capacitor (C3) to achieve the desired phase margin. For applications with typical inductor values, setting the compensation zero, fZ1, below one forth of the crossover frequency provides sufficient phase margin. Determine the C3 value by the following equation: C f 3 R 2 4 3 C × × π > 3. Determine if the second compensation capacitor (C6) is required. It is required if the ESR zero of the output capacitor is located at less than half of the switching frequency, or the following relationship is valid: 2 f R 2 C 2 1 S ESR < × × π If this is the case, then add the second compensation capacitor (C6) to set the pole fP3 at the location of the ESR zero. Determine the C6 value by the equation: 3 R R 2 C 6 C ESR × = PCB Layout Guide PCB layout is very important to achieve stable operation. Please follow these guidelines and take Figure 4 for references. 1) Keep the path of switching current short and minimize the loop area formed by Input cap, high-side and low-side MOSFETs. 2) Keep the connection of low-side MOSFET between SW pin and input power ground as short and wide as possible. 3) Ensure all feedback connections are short and direct. Place the feedback resistors and compensation components as close to the chip as possible. 4) Route SW away from sensitive analog areas such as FB. 5) Connect IN, SW, and especially GND respectively to a large copper area to cool the chip to improve thermal performance and long-term reliability. Top Layer |
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