MP62340 datasheet(2/12 Pages) MPS

2 / 12 page

MP62340/MP62341 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES

MP62340/MP62341 Rev.1.0

www.MonolithicPower.com

12/10/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Enable

Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Top

Marking

Free Air

Temperature

Range (TA)

MP62340DS

SOIC8

62340DS

MP62340DH

Active

Low

MSOP8E

62340DH

MP62341DS

SOIC8

62341DS

MP62341DH

Active

High

Dual

1.5A

MSOP8E

62341DH

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP62340DS -LF–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP62340DS -LF–Z)

PACKAGE REFERENCE

GND

EN1*

EN2*

FLAG1

OUT1

OUT2

FLAG2

TOP VIEW

SOIC8

GND

EN1*

EN2*

FLAG1

OUT1

OUT2

FLAG2

TOP VIEW

EXPOSED PAD

ON BACKSIDE

MSOP8E

MP62340/MP62341

Dual-Channel

(* EN is active high for MP62341)

ABSOLUTE MAXIMUM RATINGS (1)

IN................................................ -0.3V to +6.0V

EN, FLAG, OUT to GND ............. -0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

MSOP8E.................................................... 2.3W

SOIC8..................................................... 1.4W

Junction Temperature.............................. 150°C

Lead Temperature ................................... 260°C

Storage Temperature.............. –65°C to +150°C

Operating Junction Temp (TJ) ... –40°C to +125°C

Thermal Resistance

(3)

θJA

θJC

SOIC8 .................................... 90 ...... 42...

°C/W

MSOP8E ................................ 55 ...... 12...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of

themaximum junction temperature TJ (MAX), the junction-

toambient

thermal

resistance

θJA,

and

the

ambient

temperature TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA)/θJA. Exceeding the maximum

allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage.

3) Measured on JESD51-7， 4-layer PCB.

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