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MP62350 数据表(PDF) 2 Page - Monolithic Power Systems |
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MP62350 数据表(HTML) 2 Page - Monolithic Power Systems |
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2 / 12 page ![]() MP62350/MP62351 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES MP62350/MP62351 Rev. 0.91 www.MonolithicPower.com 2 9/18/2009 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2009 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Enable Switch Maximum Continuous Load Current Typical Short- Circuit Current @ TA=25C Package Temperature MP62351ES Active High Dual 0.5A 750mA SOIC8 MP62351EK Active High Dual 0.5A 750mA MSOP8 MP62350ES Active Low Dual 0.5A 750mA SOIC8 MP62350EK Active Low Dual 0.5A 750mA MSOP8 –20 °C to +85°C * For Tape & Reel, add suffix –Z (eg. MP62350/MP62351ES–Z). For RoHS Compliant Packaging, add suffix –LF (eg. MP62350/MP62351ES–LF–Z) PACKAGE REFERENCE 1 2 3 4 8 7 6 5 TOP VIEW EN1* FLAG1 FLAG2 EN2* OUT1 IN GND OUT2 MSOP8 EN1* FLAG1 FLAG2 EN2* OUT1 IN GND OUT2 1 2 3 4 8 7 6 5 TOP VIEW SOIC8 *: EN is active high for MP62351 ABSOLUTE MAXIMUM RATINGS (1) IN .................................................-0.3V to +6.0V EN, FLAG, OUT to GND ..............-0.3V to +6.0V Continuous Power Dissipation (TA = +25°C) (2) SOIC8……………………………………......1.4W MSOP8……………………………………....0.8W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature...............–65°C to +150°C Operating Temperature..............–20°C to +85°C Thermal Resistance (3) θJA θJC SOIC8..................................... 90 ...... 42... °C/W MSOP8 .................................. 150 ..... 65... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Measured on JESD51-7, 4-layer PCB. |
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