ADP1650ACBZ-R7 datasheet(6/32 Pages) AD

6 / 32 page

ADP1650

Rev. C | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN, SDA, SCL, EN, GPIO1, GPIO2, STROBE,

LED_OUT, SW, VOUT to Power Ground

−0.3 V to +6 V

PGND to SGND

−0.3 V to +0.3 V

Ambient Temperature Range (TA)

−40°C to +85°C

Junction Temperature Range (TJ)

−40°C to +125°C

Storage Temperature

JEDEC J-STD-020

ESD Human Body Model

±2000 V

ESD Charged Device Model

±500 V

ESD Machine Model

±150 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

The ADP1650 may be damaged if the junction temperature

limits are exceeded. Monitoring TA does not guarantee that TJ

is within the specified temperature limits. In applications with

high power dissipation and poor thermal resistance, the maximum

TA may have to be derated. In applications with moderate power

dissipation and low PCB thermal resistance, the maximum TA

can exceed the maximum limit as long as the TJ is within speci-

fication limits. TJ of the device is dependent on the TA, the power

dissipation (PD) of the device, and the junction-to-ambient

thermal resistance (θJA) of the package. Maximum TJ is

calculated from the TA and PD using the following formula:

TJ = TA + (PD × θJA)

THERMAL RESISTANCE

θJA of the package is based on modeling and calculation using

a 4-layer board. θJA is highly dependent on the application and

board layout. In applications where high maximum power dissi-

pation exists, attention to thermal board design is required. The

value of θJA may vary, depending on PCB material, layout, and

environmental conditions. The specified value of θJA is based

on a 4-layer, 4 in × 3 in, 2 ½ oz copper board, per JEDEC

standards. For more information, see the AN-617 Application

Note, MicroCSP™ Wafer Level Chip Scale Package.

θJA is specified for a device mounted on a JEDEC 2S2P PCB.

Table 5. Thermal Resistance

Package Type

θJA

Unit

12-Ball WLCSP

°C/W

10-Lead LFCSP

42.5

°C/W

ESD CAUTION

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