LT3592

22

3592fc

PACKAGE DESCRIPTION

DDB Package

10-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1722 Rev Ø)

2.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

0.64

± 0.05

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

2.39

±0.05

(2 SIDES)

3.00

±0.10

(2 SIDES)

1

5

10

6

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0 – 0.05

(DDB10) DFN 0905 REV Ø

0.25

± 0.05

2.39

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.64

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

PIN 1

R = 0.20 OR

0.25

× 45°

CHAMFER

0.50 BSC