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CD00237391 数据表(PDF) 13 Page - STMicroelectronics |
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CD00237391 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 177 page ![]() Operating temperatures Ambient temperatures: –40 to +85 °C /–40 to +105 °C Junction temperature: –40 to + 125 °C Package LQFP64 LQFP64 WLCSP64 +2 LQFP6 4 LQFP64 WLCSP6 4+2 LQFP100 LQFP144 1. For the LQFP100 package, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. 2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3. VDD minimum value is 1.7 V when the device operates in the 0 to 70 °C temperature range and IRROFF is set to VDD. Table 2. STM32F205xx features and peripheral counts (continued) Peripherals STM32F205Rx STM32F205Vx STM32F205Zx Table 3. STM32F207xx features and peripheral counts Peripherals STM32F207Vx STM32F207Zx STM32F207Ix Flash memory in Kbytes 256 512 768 1024 256 512 768 1024 256 512 768 1024 SRAM in Kbytes System (SRAM1+SRAM2) 128 (112+16) Backup 4 FSMC memory controller Yes(1) Ethernet Yes Timers General-purpose 10 Advanced-control 2 Basic 2 IWDG Yes WWDG Yes RTC Yes Random number generator Yes |
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