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ST6201CM-Auto 数据表(PDF) 87 Page - STMicroelectronics |
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ST6201CM-Auto 数据表(HTML) 87 Page - STMicroelectronics |
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87 / 96 page ![]() Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s) ST6200CM-Auto/ ST6201CM-Auto/ST6203CM-Auto 87/96 PACKAGE MECHANICAL DATA (Cont’d) Figure 70. 16-Pin Ceramic Side-Brazed Dual In-Line Package 12.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) SO16 SSOP16 90 125 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C Dim. mm inches Min Typ Max Min Typ Max A 3.78 0.149 A1 0.38 0.015 B 0.36 0.46 0.56 0.014 0.018 0.022 B1 1.14 1.37 1.78 0.045 0.054 0.070 C 0.20 0.25 0.36 0.008 0.010 0.014 D 19.86 20.32 20.78 0.782 0.800 0.818 D1 17.78 0.700 E1 7.04 7.49 7.95 0.277 0.295 0.313 e 2.54 0.100 G 6.35 6.60 6.86 0.250 0.260 0.270 G1 9.47 9.73 9.98 0.373 0.383 0.393 G2 1.02 0.040 L 2.92 3.30 3.81 0.115 0.130 0.150 S 1.27 0.050 Ø 4.22 0.166 Number of Pins N16 CDIP16W 1 |
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