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STM32F103C4 数据表(PDF) 73 Page - STMicroelectronics |
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STM32F103C4 数据表(HTML) 73 Page - STMicroelectronics |
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73 / 90 page  STM32F103x4, STM32F103x6 Electrical characteristics Doc ID 15060 Rev 6 73/90 Figure 35. Typical connection diagram using the ADC 1. Refer to Table 46 for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown inFigure 36 or Figure 37, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 36. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. The VREF+ input is available only on the TFBGA64 package. ai14150c STM32F103xx VDD AINx IL±1 µA 0.6 V VT RAIN(1) Cparasitic VAIN 0.6 V VT RADC(1) 12-bit converter CADC(1) Sample and hold ADC converter |
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