9

FN4022.14

HIP2100

Dual Flat No-Lead Plastic Package (DFN)

Micro Lead Frame Plastic Package (MLFP)

TOP VIEW

INDEX

D1/2

D1

D/2

D

E1/2

E/2

E1

E

A

2X

0.15

B

C

A

N

BOTTOM VIEW

SEATING

PLANE

5

6

2 3

1

0.10

NX b

A1

C

2X

C

0.15

0.15

2X

B

0

A1

A

C

C

B

2X

A

C

0.15

A2

A3

AREA

//

SIDE VIEW

0.08

C

4X

9

L

5

NX b

4X P

N

e

B

0.10

C A

D2

E2

1

(Nd-1)Xe

REF.

3

2

M

7

8

8

7

6

AREA

INDEX

N-1

D2/2

NX k

5

E2/2

e

FOR EVEN TERMINAL/SIDE

L

C

TERMINAL TIP

C

C

L12.4x4A

12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

-

0.85

0.90

-

A1

0.00

0.01

0.05

-

A2

-

0.65

0.70

-

A3

0.20 REF

-

b

0.18

0.23

0.30

5, 8

D

4.00 BSC

-

D1

3.75 BSC

-

D2

2.65

2.80

2.95

7, 8

E

4.00 BSC

-

E1

3.75 BSC

-

E2

1.43

1.58

1.73

7, 8

e

0.50 BSC

-

k

0.635

-

-

-

L

0.30

0.40

0.50

8

N12

2

Nd

6

3

P

0.24

0.42

0.60

-

θ

--

12

-

Rev. 0 8/03

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.

2. N is the number of terminals.

3. Nd refer to the number of terminals on D.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land Pattern

Design efforts, see Intersil Technical Brief TB389.

9. COMPLIANT TO JEDEC MO-229-VGGD-2 ISSUE C except for

the L dimension

.