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LM317S/NOPB 数据表(PDF) 15 Page - Texas Instruments |
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LM317S/NOPB 数据表(HTML) 15 Page - Texas Instruments |
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15 / 40 page ![]() LM117, LM317A, LM317-N www.ti.com SNVS774O – MAY 2004 – REVISED JANUARY 2014 Table 1. θJA Different Heatsink Area Layout Copper Area Thermal Resistance Top Side (in2)(1) Bottom Side (in2) ( θJA°C/W) TO-252 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1.0 0 47 7 0.066 0.2 84 8 0.066 0.4 70 9 0.066 0.6 63 10 0.066 0.8 57 11 0.066 1.0 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 (1) Tab of device attached to topside of copper. Figure 30. θJA vs 2oz Copper Area for TO-252 Figure 31. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252 Copyright © 2004–2014, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: LM117 LM317A LM317-N |
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