Material Composition Specification

SMB Case

Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 mg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centra lsemi.com

R4 (3-June 2011)

Component

Material

Material

Substance CAS No.

Substance

(%wt)

(mg)

(%wt)

(mg)

(ppm)

active device

doped Si

0.83%

0.76

Si

7440-21-3

0.83%

0.76

8,262

leadframe

copper

37%

34.04

Cu

7440-50-8

37%

34.04

370,032

die attach

high temperature

solder paste

2.45%

2.25

Pb

7439-92-1

2.26%

2.081

22,622

Sn

7440-31-5

0.12%

0.113

1,228

Ag

7440-22-4

0.06%

0.056

609

encapsulation*

EMC

58.96%

54.23

silica

7631-86-9

40.09%

36.88

400,904

epoxy resin

29690-82-2

11.79%

10.85

117,945

phenol resin

9003-35-4

5.89%

5.42

58,918

Sb2O3

1309-64-4

0.59%

0.542

5,892

Br

7726-95-6

0.59%

0.542

5,892

EMC GREEN

58.96%

54.23

silica (fused) 60676-86-0

45.4%

41.76

453,953

epoxy resin

29690-82-2

5.9%

5.423

58,951

phenol resin

9003-35-4

5.72%

5.26

57,179

carbon black

1333-86-4

0.18%

0.163

1,772

metal

hydroxide

1309-42-8

1.77%

1.628

17,697

plating**

tin/lead process

0.77%

0.71

Sn

7440-31-5

0.62%

0.566

6,153

Pb

7439-92-1

0.15%

0.142

1,544

matte tin

0.77%

0.71

Sn

7440-31-5

0.77%

0.708

7,696

*EMC GREEN molding compound is Halogen-Free.

**For Lead Free plating, add suffix “LEAD FREE” to part number.

For Tin/Lead plating, add suffix “TIN/LEAD” to part number.

No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.