AD590

Data Sheet

Rev. G | Page 14 of 16

Figure 27. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

Figure 28. 4-Lead Lead Frame Chip Scale Package [LFCSP_WD]

2.00 mm × 3.00 mm Body, Very Very Thin, Dual Lead

(CP-4-1)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

85

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

1.65

1.55

1.45

0.50

0.40

0.30

TOP VIEW

4

1

3

2

0.35

0.30

0.25

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.80

1.70

1.60

0.203 REF

0.05 MAX

0.00 MIN

0.80 REF

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATIONS

SECTION OF THIS DATA SHEET.

2.10

2.00

1.90

3.10

3.00

2.90

COMPLIANT

TO JEDEC STANDARDS MO-229

COPLANARITY

0.08

0.20 MIN