AD8502/AD8504

Rev. A | Page 14 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-178-BA

8°

4°

0°

SEATING

PLANE

1.95

BSC

0.65 BSC

0.60

BSC

76

12

34

5

3.00

2.90

2.80

3.00

2.80

2.60

1.70

1.60

1.50

1.30

1.15

0.90

0.15 MAX

0.05 MIN

1.45 MAX

0.95 MIN

0.22 MAX

0.08 MIN

0.38 MAX

0.22 MIN

0.60

0.45

0.30

PIN 1

INDICATOR

8

Figure 40

. 8-Lead Small Outline Transistor Package [SOT-23]

(RJ-8)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

8°

0°

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65 BSC

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

0.75

0.60

0.45

COPLANARITY

0.10

SEATING

PLANE

Figure 41. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8502ARJZ-R21

−40°C to +125°C

8-Lead SOT-23

RJ-8

A1D

AD8502ARJZ-REEL1

−40°C to +125°C

8-Lead SOT-23

RJ-8

A1D

AD8502ARJZ-REEL71

−40°C to +125°C

8-Lead SOT-23

RJ-8

A1D

AD8504ARUZ1

−40°C to +125°C

14-Lead TSSOP

RU-14

AD8504ARUZ-REEL1

−40°C to +125°C

14-Lead TSSOP

RU-14