www.austriamicrosystems.com/AS3490

1.2

3 - 18

AS3490

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Table 3, “Electrical

Characteristics,” on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VIN, ON and ISET to GND

-0.3

+7.0

V

ON and ISET to VIN

+0.3

V

internal protection diodes to VIN

SW, VOUT, LED1...LED3 to GND

-0.3

11

V

SW, LED1...LED3 to VOUT

+0.3

V

internal protection diodes to VOUT

Input Pin Current without causing latchup

-100

+100

mA

Norm: EIA/JESD78

Continuous power dissipation

870

mW

1. Depending on actual PCB layout and PCB used

Continuous power dissipation derating factor

11.67

mW/ºC

2

Electrostatic Discharge

ESD HBM

±2000

V

Norm: JEDEC JESD22-A114F

ESD CDM

±500

V

Norm: JEDEC JESD 22-C101E

ESD MM

±100

V

Norm: JEDEC JESD 22-A115-B

Temperature Ranges and Storage Conditions

Junction Temperature

+125

ºC

Storage Temperature Range

-55

+125

ºC

Humidity

5

85

%

Non condensing

Body Temperature during Soldering

+260

ºC

according to IPC/JEDEC J-STD-020

Moisture Sensitivity Level (MSL)

MSL 1

Represents a max. floor life time of

unlimited