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AS3606 数据表(PDF) 9 Page - ams AG

部件名 AS3606
功能描述  System PMU with HV Back Light Driver
PDF  71 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AMSCO [ams AG]
网页  http://www.ams.com
标志 AMSCO - ams AG

AS3606 数据表(HTML) 9 Page - ams AG

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www.austriamicrosystems.com
Revision 1.03
8 - 70
AS3606 AS3607 2v2
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 9 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. The device should be operated under recommended operating
conditions.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
5V pins
-0.5
7.0
V
Applicable for pins VBATSW, VSUPSW, VSUP1/
2/3/4/5, PWRUP, GPIO1/2/3/4, VBUS
3V pins
-0.5
5.0
V
Applicable for pins DVDD
30V pins
-0.5
32
V
Applicable for pin LXSU, CURR1/2
5V pins with protection to VSUPx
-0.5
7.0
VSUPx+0.5
V
Applicable for pins EXTBATSW, FBSU
3V pins with protection to VDD27
-0.5
5.0
VDD27
V
Applicable for pins BATTEMP
3V pins with protection to DVDD
-0.5
5.0
DVDD+0.5
V
Applicable for pins XIRQ, XRES, CSCL, CSDA
3V pins with protection to VSUPx
-0.5
5.0
VSUPx+0.5
V
Applicable for pins PVDD1/2/3/4, VDD27,
CVDD1/2/3, LXC1,/2/3
Input Current (latch-up immunity)
-100
100
mA
Norm: JEDEC 78
Continuous Power Dissipation (TA = +85ºC)
Continuous power dissipation
1W
PT
1 for QFN32/36 package (RTH ~ 30K/W)
1. Depending on actual PCB layout and PCB used
Electrostatic Discharge
Electrostatic Discharge HBM
±1.5
kV
Norm: JEDEC JESD22-A114C
Temperature Ranges and Storage Conditions
Junction Temperature
+110
ºC
Storage Temperature Range
-55
+125
ºC
Humidity non-condensing
585
%
Temperature (soldering)
Package Body Temperature
260
ºC
Norm IPC/JEDEC J-STD-020
2
The lead finish for Pb-free leaded packages is
matte tin (100% Sn)
2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State Surface Mount Devices”
Moisture Sensitive Level
3
Represents a max. floor live time of 168h



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