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TCS3413CS 数据表(PDF) 35 Page - ams AG |
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TCS3413CS 数据表(HTML) 35 Page - ams AG |
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35 / 41 page ![]() TCS3404, TCS3414 DIGITAL COLOR SENSORS TAOS137A − APRIL 2011 34 r r Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com MECHANICAL DATA PACKAGE CS Six-Lead Chipscale 950 Nominal 350 + 10 1565 + 10 2095 463 + 30 610 Nominal 438 + 30 TOP VIEW BOTTOM VIEW END VIEW Lead Free Pb 6 y j 300 + 30 PINOUT TOP VIEW SCL A1 SYNC A2 GND A3 B1 SDA B2 VDD B3 INT PHOTODIODE ARRAY 1875 128 Nominal CL of Solder Bumps and Photodiode Array Area 6 y 160 + 30 405 + 20 685 + 45 CL of Solder Bumps CL of Photodiode Array Area NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted. B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%). C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. D. This drawing is subject to change without notice. Figure 31. Package CS — Six-Lead Chipscale Packaging Configuration |
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