TSL201CL

64 y 1 LINEAR SENSOR ARRAY

TAOS146 − APRIL 2012

12

r

r

Copyright

E 2012, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

SOLDERING INFORMATION

The CL package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat exposure of components during the solder

reflow process of product on a PCB. Temperature is measured on top of component. The components should

be limited to a maximum of three passes through this solder reflow profile.

Table 1. Solder Reflow Profile

PARAMETER

REFERENCE

DEVICE

Average temperature gradient in preheating

2.5

°C/sec

Soak time

2 to 3 minutes

Time above 217

°C (T1)

Max 60 sec

Time above 230

°C (T2)

Max 50 sec

Max 10 sec

Peak temperature in reflow

260

°C

Temperature gradient in cooling

Max −5

°C/sec

Not to scale — for reference only

Time (sec)

Figure 8. Solder Reflow Profile Graph