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LTC1663-1CS5 数据表(PDF) 11 Page - Linear Integrated Systems |
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LTC1663-1CS5 数据表(HTML) 11 Page - Linear Integrated Systems |
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11 / 12 page ![]() LTC1663 11 1663fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. S5 Package 5-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1635) PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660) 1.50 – 1.75 (NOTE 4) 2.80 BSC 0.30 – 0.45 TYP 5 PLCS (NOTE 3) DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S5 TSOT-23 0302 PIN ONE 2.90 BSC (NOTE 4) 0.95 BSC 1.90 BSC 0.80 – 0.90 1.00 MAX 0.01 – 0.10 0.20 BSC 0.30 – 0.50 REF NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3.85 MAX 0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN 2.62 REF 1.22 REF MSOP (MS8) 0204 0.53 ± 0.152 (.021 ± .006) SEATING PLANE NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.18 (.007) 0.254 (.010) 1.10 (.043) MAX 0.22 – 0.38 (.009 – .015) TYP 0.127 ± 0.076 (.005 ± .003) 0.86 (.034) REF 0.65 (.0256) BSC 0° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 12 3 4 4.90 ± 0.152 (.193 ± .006) 8 7 6 5 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 0.52 (.0205) REF 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 ± 0.127 (.035 ± .005) RECOMMENDED SOLDER PAD LAYOUT 0.42 ± 0.038 (.0165 ± .0015) TYP 0.65 (.0256) BSC |
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