3

Electronic Solutions Division

Interconnect Solutions

http://www.3Mconnectors.com

3M is a trademark of 3M Company.

For technical, sales or ordering information call

800-225-5373

Surfacemount

8400 Series

• Accepts chip carriers conforming to JEDEC outline

MO-047 for square and MO-052 for rectangular

• High temperature insulator compatible with IR reflow

and wave soldering

• Compatible with automated loading equipment

• Open top design allows unrestricted air flow

• Molded slots for ease of device extraction

• Available with optional PCB locating posts

• RoHS Compliant. See the Regulatory Information

Appendix (RIA) in the "RoHS Compliance" section

of www.3Mconnector.com for compliance

information (RIA E1 and C1 apply)

Date Modified: September 14, 2011

TS-2147-B

Sheet 1 of 2

Physical

Insulation

Material: Glass Filled Polyphenylene Sulfide (PPS)

Flammability: UL 94V-0

Color: Black

Contact

Material: Copper Alloy

Plating

Underplating: 50 µ" [ 1.27 µm ] Nickel - Overall

Wiping Area: 160 µ", [ 4.06 µm ] Matte Tin

Electrical

Environmental

Notice:

Please be aware that the 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Since tin

whiskers are an inherent characteristic of tin and mechanically stressing the tin is a known driver of whisker growth, it is possible the PLCC and PLCC socket may exhibit tin whisker growth after

mating. 3M follows the iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Please consider whether a PLCC

socket is suitable for your particular needs after considering your product applications life span and environment including mechanical stresses, humidity, and thermal cycling all of which have

been shown to stimulate tin whisker growth.