LP2950, LP2951, NCV2951

http://onsemi.com

3

Rating

Symbol

Value

Unit

Input Voltage

30

Vdc

Peak Transient Input Voltage (t < 20 ms)

32

Vdc

Power Dissipation and Thermal Characteristics

Maximum Power Dissipation

Internally Limited

W

Case 751(SOIC−8) D Suffix

Thermal Resistance, Junction−to−Ambient

180

C/W

Thermal Resistance, Junction−to−Case

45

C/W

Case 369A (DPAK) DT Suffix (Note 1)

Thermal Resistance, Junction−to−Ambient

92

C/W

Thermal Resistance, Junction−to−Case

6.0

C/W

Case 29 (TO−226AA/TO−92) Z Suffix

Thermal Resistance, Junction−to−Ambient

160

C/W

Thermal Resistance, Junction−to−Case

83

C/W

Case 626 N Suffix

Thermal Resistance, Junction−to−Ambient

105

C/W

Case 846A (Micro8) DM Suffix

Thermal Resistance, Junction−to−Ambient

240

C/W

Feedback Input Voltage

−1.5 to +30

Vdc

Shutdown Input Voltage

−0.3 to +30

Vdc

Error Comparator Output Voltage

−0.3 to +30

Vdc

Operating Ambient Temperature Range

−40 to +125

C

Maximum Die Junction Temperature Range

+150

C

Storage Temperature Range

−65 to +150

C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.