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Document Number: 31006

72

Revision: 06-Jul-06

TNPW

Vishay

High Stability Thin Film Chip Resistor

≤ 0.05 % (1000 h rated power at 70 °C)

TEST AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

EN 60115-1, Generic specification (includes tests)

EN 140 400, Sectional specification (includes schedule for

qualification approval)

EN 140 401-801, Detail specification (includes schedule for

conformance inspection)

The following table contains only the most important tests.

For the full test schedule refer to the documents listed above.

The testing also covers most of the requirements specified

by EIA/IS-703 and JIS-C-5202. The tests are carried out in

accordance with IEC 60068 and under standard atmospheric

conditions in accordance with IEC 60068-1, 5.3. Climatic

category LCT/UCT/56 (rated temperature range: Lower

Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days) is valid. Unless otherwise specified

the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).

The components are mounted for testing on boards in

accordance with EN 60115-1, 4.31 unless otherwise

specified. The parameters stated in the Test Procedures and

Requirements table are based on the required tests and

permitted limits of EN 140 401-801. However, some

additional tests and a number of improvements against those

minimum requirements have been included.

TEST PROCEDURES AND REQUIREMENTS

TEST

CONDITIONS OF TEST

TEST RESULTS

TNPW0402 TO TNPW2512

TOLERANCES

± 0.1 %; ± 0.25 %

± 0.5 %; ± 1.0 %

< 100R

≥ 100R

Endurance Test at 70 °C

IEC 60115-1 4.25.1

1000 hours at 70 °C, 1.5 hours “ON”, 0.5 hours

“OFF”

≤ ± 0.1 %

≤ ± 0.05 %

≤ ± 0.25 %

Endurance at UCT

IEC 60115-1 4.25.3

1000 hours at 125

°C without load

≤ ± 0.1 %

≤ ± 0.05 %

≤ ± 0.5 %

Overload Test

IEC 60115-1 4.13

Short time overload for 2 seconds

2.5 x rated voltage or

≤ 2 x limiting element voltage

≤ ± 0.05 %

≤ ± 0.02 %

≤ ± 0.1 %

Thermal Shock

IEC 60115-1 4.19, IEC 60068-2-14

Rapid change between upper and lower

category temperature

≤ ± 0.05 %

≤ ± 0.02 %

≤ ± 0.1 %

Damp Heat Steady State

IEC 60115-1 4.24, IEC 60068-2-3

56 days at 40

°C and 93 % relative humidity

≤ ± 0.1 %

≤ ± 0.05 %

≤ ± 0.5 %

Resistance to Soldering Heat

IEC 60115-1 4.18, IEC 60068-2-20

10 seconds at 260

°C solder bath temperature

≤ ± 0.05 %

≤ ± 0.02 %

≤ ± 0.1 %

APPLICABLE SPECIFICATIONS

• CECC40000/40400

• EN140400

• EIA 575

• EN 140401-801

• EN 60115-1

• IEC 60286-3