ADP2139ACBZ-1.0-R7 datasheet(4/20 Pages) AD

4 / 20 page

ADP2138/ADP2139

Data Sheet

Rev. C | Page 4 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN, EN, MODE

−0.4 V to +6.5 V

VOUT, SW to GND

−1.0 V to (VIN + 0.2 V)

Temperature Range

Operating Ambient

−40°C to +85°C

Operating Junction

−40°C to +125°C

Storage Temperature

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

ESD Model

Human Body

±1500 V

Charged Device

±500 V

Machine

±100 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

ADP2138/ADP2139 can be damaged when the junction tempera-

ture limits are exceeded. Monitoring ambient temperature does

not guarantee that the junction temperature (TJ) is within the

specified temperature limits. In applications with high power

dissipation and poor thermal resistance, the maximum ambient

temperature may need to be derated. In applications with mod-

erate power dissipation and low printed circuit board (PCB)

thermal resistance, the maximum ambient temperature can

exceed the maximum limit for as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA). Maximum junction

temperature (TJ) is calculated from the ambient temperature

(TA) and power dissipation (PD) using the formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The specified

values of θJA are based on a 4-layer, 4 in. × 3 in., circuit board. Refer

to JEDEC JESD 51-9 for detailed information pertaining to board

construction. For additional information, see AN-617 Application

Note, MicroCSPTM

Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

measured in units of °C/W. ΨJB of the package is based on modeling

and calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing through

multiple thermal paths rather than through a single path, which

is the procedure for measuring thermal resistance, θJB. There-

fore, ΨJB thermal paths include convection from the top of the

package as well as radiation from the package; factors that make

ΨJB more useful in real-world applications than θJB. Maximum

junction temperature (TJ) is calculated from the board temperature

(TB) and power dissipation (PD) using the formula

TJ = TB + (PD × ΨJB)

Refer to JEDEC JESD51-8 and JESD51-12 for more detailed

information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

6-Ball WLCSP

170

°C/W

ESD CAUTION

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