31

2

Accu-L

SMD High-Q RF Inductor

TEST

CONDITIONS

REQUIREMENT

Solderability

Components completely immersed in

Terminations to be well tinned.

a solder bath at 235 ± 5°C for 2 secs.

No visible damage.

Leach Resistance

Components completely immersed in

Dissolution of termination faces

a solder bath at 260 ±5°C for 60 secs.

≤ 15% of area.

Dissolution of termination edges

≤ 25% of length.

Storage

12 months minimum with components

Good solderability

stored in “as received” packaging.

Shear

Components mounted to a substrate.

No visible damage

A force of 5N applied normal to the

line joining the terminations and in

a line parallel to the substrate.

Rapid Change of

Components mounted to a substrate.

No visible damage

Temperature

5 cycles -55°C to +125°C.

Tested as shown in diagram

Bend Strength

No visible damage

Temperature

Component placed in

+0 to +125 ppm/°C

Coefficient of

environmental chamber

(typical)

Inductance

-55°C to +125°C.

(TCL)

FINAL QUALITY INSPECTION

Finished parts are tested for electrical parameters and visual/

mechanical characteristics.

Parts are 100% tested for inductance at 450MHz. Parts are

sample basis for:

• Q at test frequency

• Static Humidity Resistance: 85°C, 85% RH, 160 hours

1mm

deflection

45mm

45mm

TCL =

• 10

6

ENVIRONMENTAL CHARACTERISTICS