69

ICs

SI-3000LU Series

■External Dimensions (SOT89-5)

Pin Assignment

q ADJ

w GND

Plastic Mold Package Type

Flammability: UL94V-0

Product Mass: Approx. 0.05g

(Unit : mm)

( 1.0

±0.0

φ

tr

qw

e

■Block Diagram

■Typical Connection Diagram

■Reference Data

For SI-3000LU series, Co has to be a low ESR capacitor such as a

ceramic capacitor.

R1 and R2: Resistors for output setting

The output voltage can be set by connecting R1 and R2 as shown in the

diagram on the left.

R2: 100 kΩ is recommended

SI-3012LU

REF

TSD

+

–

GND

4

3

5

2

ADJ

1

Copper Laminate Area vs Power Dissipation

SI-3012LU

4

3

2

5

1

+

GND

1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

10

100

1000

Ta=25°C

Ta=40°C

Ta=60°C

Ta=85°C

Case temperature Tc

measurement point

•A monolithic ICs mounts an inner frame stage that is connected to the GND

pin (pin 2). Therefore, enlarging the copper laminate area connected to the

GND pin improves heat radiation effect.

• Obtaining the junction temperature

thermocouple, etc. Then, substitute this value in the following formula to

obtain the junction temperature.

(θj–c=5°C/W)