Application Notes

1. Module is intended for use with 350 mA constant current drive condition as is provided by the OT9/100-120/350 and OT9/10-24/350

DIM E (see PIB ECS052R1 for details). The module is not intended for use with constant voltage power supplies, including other OSRAM

LED power supplies.

2. For the white, blue and verde DRAGONtape products, the OT9 power supplies can power up to six LEDs (i.e. one complete module).

For the yellow and red DRAGONtape products, the OT9 can power up to 9 LEDs (i.e. 1.5 modules).

3. Installation of the DRAGONtape must include provision for thermal management to avoid premature failure of the product and to obtain

expected service life. Service life (i.e. lumen depreciation) is primarily a function of LED temperature which is to be monitored on the circuit

board at the designated “Tc-Point”. (A Tc-Point temperature of 40°C should be sufficient to enable a service life of 50,000 hours for the

white DRAGONtape.)

4. There is no exact installation prescription to obtaining an appropriate Tc-Point temperature because every fixture design is different. In

general, the DRAGONtape module should be adhered to a clean, flat metal surface which has enough surface area to transfer the heat from

the LED to the surrounding air. The metal surface can be part of a conventional finned heat sink or can be part of the mass of the fixture

itself. A very “ballpark” starting point can be interpreted from the chart below which shows approximate heat sink surface area requirements

for given service life expectations for individual DRAGON LEDs (i.e multiply area values by six for an entire DRAGONtape module).

5. Concerning fixture design, it is important to understand that once heat is transferred to a “heat sink”, that heat must still be allowed to

escape the “system”. A heat sink transferring the thermal energy to the inside of an enclosed cavity may ultimately be of little use.

6. The fixture makers’ strategy should be to design a prototype fixture and test that fixture in an appropriate ambient environment while

monitoring the temperature at the Tc-Point which should be allowed enough time to reach thermal equilibrium. In the end, the heat sink

areas from the chart below only represent a starting point for initial design work while the Tc-Point temperature serves as the emperical

test of proper thermal management. Tc-Point temperature can be measured with a standard thermocouple in direct contact with the

circuit board at the Tc-Point or by use of ML4C Series non-reversible OMEGALABELS (www.omega.com) or equivalent.

Approximate Heat Sink Size to Reach Lifetime Targets per LED

(Vertically oriented flat aluminum plate: total cooling surface area equals 2x footprint area)

Service Life to 50% Initial Light Intensity (hours)