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LM7372IMA 数据表(PDF) 16 Page - National Semiconductor (TI) |
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LM7372IMA 数据表(HTML) 16 Page - National Semiconductor (TI) |
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16 / 26 page ![]() 1 10 100 FREQUENCY (MHz) 1 10 100 1000 10V supply (1 amplifier) 10V supply (2 amplifiers) 30V supply (1 amplifier) 30V supply (2 amplifiers) 8-Pin SO PowerPAD = 47°C/W T = 85°C T = 140°C q JA A J LM7372 SNOS926E – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 27. Power Supply Current Increase Figure 27 shows that there could be 1mA or more excess supply current per amplifier with close to full output swing (24VPP) when frequency is just above 1MHz (or at higher frequencies when the output swing is less). This boost in supply current enables the output to “keep up” with high frequency/large signal output swing, but in turn, increases the total package power dissipation and therefore raises the device junction temperature. As a consequence, these demanding applications, especially ones which run at higher supply voltages, need special attention to the package heatsink design. For that reason, Figure 27 has the safe operating limits for the 8-Pin SO PowerPAD package (e.g. “30V supply (2 amplifiers)” horizontal line) superimposed on top of it (with TJ limit of 140°C when operated at 85°C ambient), so that the designer can readily decide whether or not there is need for additional heat sinking. For example, if the LM7372 is operating similarly to Figure 1 schematic with a single power supply of 10V, Figure 27 shows that it is safe to have up to 10VPP output swing at up to 40MHz with no additional heat sinking. This determination is from inspection of Figure 27 where the “10V supply (2 amplifiers)” safe operating limit intercepts the 10VPP swing graph at around 40MHz. Use the “10V supply (1 amplifier)” safe operating limit line in cases where the second amplifier in the LM7372 package does not experience high frequency/high output swing conditions. At any given “IS increase” value (y axis), the product of frequency and output swing remains essentially constant for all output swing plots. This holds true for the lower frequency range before the plots experience a slope increase. Therefore, if the application example just discussed operates up to 60MHz instead, it is possible to calculate the junction-temperature-limited maximum output swing of 6.7VPP(= 40MHz x 10VPP/60MHz) instead. Please note that Figure 27 precludes any additional amplifier power dissipation related to load (this topic is discussed below in detail). This load current, if large enough, will reduce the operating frequency/output swing further. It is important to note that the LM7372 can be destroyed if it is allowed to dissipate enough power that compromises its maximum junction temperature limit of 150°C. With the op amp tied to a load, the device power dissipation consists of the quiescent power due to the supply current flow into the device, in addition to power dissipation due to the load current. The load portion of the power itself could include an average value (due to a DC load current) and an AC component. DC load current would flow if there is an output voltage offset, or the output AC average current is non-zero, or if the op amp operates in a single supply application where the output is maintained somewhere in the range of linear operation. Therefore: 16 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM7372 |
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