OPA320, OPA2320

OPA320S, OPA2320S

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SBOS513E – AUGUST 2010 – REVISED JUNE 2013

THERMAL INFORMATION: OPA320, OPA320S

OPA320

OPA320S

DBV (SOT23)

DBV (SOT23)

UNITS

5 PINS

6 PINS

Junction-to-ambient thermal resistance

219.3

177.5

Junction-to-case(top) thermal resistance

107.5

108.9

Junction-to-board thermal resistance

57.5

27.4

°C/W

Junction-to-top characterization parameter

7.4

13.3

Junction-to-board characterization parameter

56.9

26.9

Junction-to-case(bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2320, OPA2320S

OPA2320

OPA2320S

D (SO)

DGK (MSOP)

DRG (DFN)

DGS (MSOP)

UNITS

8 PINS

8 PINS

8 PINS

10 PINS

Junction-to-ambient thermal resistance

122.6

174.8

50.6

171.5

Junction-to-case(top) thermal resistance

67.1

43.9

54.9

43.0

Junction-to-board thermal resistance

64.0

95.0

25.2

91.4

°C/W

Junction-to-top characterization parameter

13.2

2.0

0.6

1.9

Junction-to-board characterization parameter

63.4

93.5

25.3

89.9

Junction-to-case(bottom) thermal resistance

N/A

N/A

5.7

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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