M34

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Vishay

Revision: 28-Jul-11

2

Document Number: 40106

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

MOUNTING

Due to the size and weight of these capacitors, we recommend that a supplemental mounting restraint to be used in printed

circuit board attachment in addition to the reflowed solder.

One recommendation is to use an adhesive such as defined in the J-STD-001DS.

This is the Space Application Electronic Hardware Addendum to J-STD-001 (Requirements for Solder Electrical and Electronic

Assemblies).

DIMENSIONS in inches [millimeters]

CASE CODE

L (MAX.)

W

H

P (MIN.)

C

0.835

[21.2]

0.315 ± 0.012

[8 ± 0.3]

0.295 ± 0.012

[7.5 ± 0.3]

0.118

[3.0]

0.236 ± 0.012

[6.0 ± 0.3]

0.075

[1.9]

RECOMMENDED REFLOW PROFILES

Lead (Pb)-free

Sn/Pb

Lead (Pb)-free

Sn/Pb

Lead (Pb)-free

Sn/Pb

Lead (Pb)-free

Sn/Pb

Lead (Pb)-free

Sn/Pb

245 °C

220 °C

10

217 °C

183 °C

150 °C

100 °C

200 °C

150 °C

60 to 150

60 to 90 60

L

WP

25 °C

TIME (s)

ALL CASE CODES

T

T

T

T

t

p

(t

L

)

PREHEAT (t