Surface Mount Resettable PTCs

Revision September 12, 2013

3 / 5

@ SOCAY Electronics Co., Ltd. 2013

Specifications are subject to change without notice.

Please refer to www.socay.com for current information.

SCF1812 Series

SOCAY Electronics Co., Ltd.

www.socay.com

Profile Feature

Pb-Free Assembly

3

°C/second max.

Preheat :

150

°C

200

°C

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

217

°C

60-150 seconds

260

°C

Time within 5

°C of actual peak:

Temperature

20-40 seconds

Ramp-down Rate:

6

°C/ second max.

Time 25

°C to Peak Temperature

8 minutes max.

Note: All temperatures refer to of the package, measured on the package body surface.

Solder reflow

Due to

“Lead Free” nature, Temperature and Dwelling time for the

soldering zone is higher than those for Regular. This may cause

damage to other components.

1. Recommended max past thickness > 0.25mm.

2. Devices can be cleaned using standard methods and aqueous

solvent.

3. Rework use standard industry practices.

4. Storage Environment : < 30

/ 60%RH

℃

Caution:

1. If reflow temperatures exceed the recommended profile, devices

may not meet the performance requirements.

2. Devices are not designed to be wave soldered to the bottom side

of the board.

Example

A

B

C

Device

Nominal

Nominal

Nominal

1812 Series

3.45

1.78

3.50

The dimension in the table below provide the recommended

pad layout for each SCF1812 device

Part Numbering

Part Marking

Soldering Parameters

Ramp-down

Preheat

Critical Zone

Time to peak temperature

(t 25℃ to peak)

25

Ramp-up

Time

Pad Layouts

Unit: mm

SCF XXX

– XXR– 1812

Device Size Code

Voltage Rating

Current Rating

Socay Product Code

F110

F XXXL

Part Identification

Logo

F XXX

XX

Part Identification

Logo

110

16

F