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SC0402ML080M 数据表(PDF) 3 Page - Socay Electornics Co., Ltd.

部件名 SC0402ML080M
功能描述  Surface Mount Multilayer Varistor
PDF  5 Pages
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制造商  SOCAY [Socay Electornics Co., Ltd.]
网页  http://www.socay.com
标志 SOCAY - Socay Electornics Co., Ltd.

SC0402ML080M 数据表(HTML) 3 Page - Socay Electornics Co., Ltd.

  SC0402ML080M Datasheet HTML 1Page - Socay Electornics Co., Ltd. SC0402ML080M Datasheet HTML 2Page - Socay Electornics Co., Ltd. SC0402ML080M Datasheet HTML 3Page - Socay Electornics Co., Ltd. SC0402ML080M Datasheet HTML 4Page - Socay Electornics Co., Ltd. SC0402ML080M Datasheet HTML 5Page - Socay Electornics Co., Ltd.  
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Surface Mount Multilayer Varistor
Revision November 28, 2013
3 / 5
@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
SC0402ML - SC0603ML Series
SOCAY Electronics Co., Ltd.
www.socay.com
Size EIA
(EIAJ)
0402
(1005)
0603
(1608)
Symbol
Inches
Millimeters
Inches
Millimeters
L
0.038
±0.005
0.96
±0.12
0.063
±0.006
1.60
±0.15
W
0.019
±0.003
0.48
±0.0.07
0.031
±0.004
0.80
±0.10
T
0.020
±0.004
0.50
±0.10
0.031
±0.008
0.80
±0.20
C
0.010
±0.006
0.25
±0.15
0.012
±0.008
0.30
±0.20
Solder cream in reflow soldering
Refer to the recommendable land pattern as printing
mask pattern for solder cream.
(1) Print solder in a thickness of 150 to 200
μm
Size EIA
(EIAJ)
0402
(1005)
0603
(1608)
Symbol
Inches
Millimeters
Inches
Millimeters
A
0.024
0.61
0.040
1.02
B
0.020
0.51
0.030
0.76
D
0.020
0.51
0.020
0.50
E
0.067
1.70
0.100
2.54
Precaution for handling of substrate
Do not exceed to bend the board after soldering thes product
extremely. (reference examples)
l Mounting place must be as far as possible from the
position, which is close to the break line of board or on the
line of large holes of board.
l Do not bend extremely the board, in mounting another
component. If necessary, use back-up pin (support pin) to
prevent from bending extremely.
l Do not break the board by hand. We recommend to use
the machine or the jig to break it.
Construction & Dimensions
L
T
C
C
W
Pad Layouts & Precaution for handling of substrate



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