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STP30NM50N 数据表(PDF) 4 Page - STMicroelectronics |
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STP30NM50N 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 18 page ![]() Electrical characteristics STB/I/F/P/W30NM50N 4/18 2 Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 5. On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage ID = 1 mA, VGS = 0 500 V IDSS Zero gate voltage drain current (VGS = 0) VDS = Max rating VDS = Max rating, TC=125 °C 1 100 µA µA IGSS Gate-body leakage current (VDS = 0) VGS = ± 20 V 100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2 3 4 V RDS(on Static drain-source on resistance VGS = 10 V, ID = 13.5 A 0.090 0.115 Ω Table 6. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit gfs (1) 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Forward transconductance VDS = 15 V, ID = 13.5 A 23 S Ciss Coss Crss Input capacitance Output capacitance Reverse transfer capacitance VDS = 50 V, f = 1 MHz, VGS = 0 2740 160 15 pF pF pF Rg Gate input resistance f=1MHz Gate DC Bias=0 Test signal level=20 mV open drain 2.7 Ω Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 400 V, ID = 27 A, VGS = 10 V (see Figure 19) 94 15 50 nC nC nC Obsolete Product(s) - Obsolete Product(s) |
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