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STPS1L60 数据表(PDF) 4 Page - STMicroelectronics

部件名 STPS1L60
功能描述  Power Schottky rectifier
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STPS1L60 数据表(HTML) 4 Page - STMicroelectronics

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Characteristics
STPS1L60
4/10
Doc ID 7504 Rev 8
Figure 7.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
Figure 8.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
0
1
2
3
4
5
6
7
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
SMA
IM
t
δ = 0.5
IM(A)
t(s)
0
2
3
4
5
6
7
8
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
IM(A)
IM
t
δ = 0.5
1
DO-41
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
t(s)
Figure 9.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (STmite flat)
Figure 10.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
0
2
4
6
8
10
12
14
16
18
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Tc = 25 °C
Tc = 75 °C
Tc = 125 °C
t(s)
IM
t
δ = 0.5
IM(A)
STmite flat
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Zth(j-a)/Rth(j-a)
tp(s)
Single pulse
SMA
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Figure 11.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Figure 12.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Single pulse
DO-41
Zth(j-a)/Rth(j-a)
tp(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Zth(j-a)/Rth(j-a)
Single pulse
tp(s)
STmite flat
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout



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