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P3203ACMCL 数据表(PDF) 3 Page - Littelfuse |
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P3203ACMCL 数据表(HTML) 3 Page - Littelfuse |
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3 / 4 page ![]() 87 SIDACtor® ProtectionThyristors © 2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Broadband Optimized™ Protection 25°C CaseTemperature (T C) - ºC 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160 Normalized V S Change vs. Junction Temperature Normalized DC Holding Current vs. Case Temperature Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone TL to TP Figure 1 Soldering Parameters Reflow Condition Pb-Free assembly (see Fig. 1) Pre Heat -Temperature Min (T s(min)) +150°C -Temperature Max (T s(max)) +200°C -Time (Min to Max) (t s) 60-180 secs. Average ramp up rate (LiquidusTemp (T L) to peak) 3°C/sec. Max. T S(max) to TL - Ramp-up Rate 3°C/sec. Max. Reflow -Temperature (T L) (Liquidus) +217°C -Temperature (t L) 60-150 secs. PeakTemp (T P) +260(+0/-5)°C Time within 5°C of actual PeakTemp (t p) 30 secs. Max. Ramp-down Rate 6°C/sec. Max. Time 25°C to PeakTemp (T P) 8 min. Max. Do not exceed +260°C Physical Specifications Environmental Specifications Lead Material Copper Alloy Terminal Finish 100% Matte-Tin Plated Body Material UL recognized epoxy meeting flammability classification 94V-0 High Temp Voltage Blocking 80% Rated V DRM (VAC Peak ) +125°C or +150°C, 504 or 1008 hrs. MIL-STD-750 (Method 1040) JEDEC, JESD22-A-101 Temp Cycling -65°C to +150°C, 15 min. dwell, 10 up to 100 cycles. MIL-STD-750 (Method 1051) EIA/JEDEC, JESD22-A104 Biased Temp & Humidity 52 V DC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/ JEDEC, JESD22-A-101 High Temp Storage +150°C 1008 hrs. MIL-STD-750 (Method 1031) JEDEC, JESD22-A-101 Low Temp Storage -65°C, 1008 hrs. Thermal Shock 0°C to +100°C, 5 min. dwell, 10 sec. transfer, 10 cycles. MIL-STD-750 (Method 1056) JEDEC, JESD22-A-106 Autoclave (Pressure Cooker Test) +121°C, 100%RH, 2atm, 24 up to 168 hrs. EIA/ JEDEC, JESD22-A-102 Resistance to Solder Heat +260°C, 30 secs. MIL-STD-750 (Method 2031) Moisture Sensitivity Level 85%RH, +85°C, 168 hrs., 3 reflow cycles (+260°C Peak). JEDEC-J-STD-020, Level 1 -8 -40 -20 0 20 40 60 80 100 120 140 160 -6 -4 0 2 4 6 8 10 12 14 Junction Temperature (T J) – °C 25 °C |
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