MP02 XX 260 Series

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Part number is made up as follows:

MP02 HB 260 - 12

MP

= Pressure contact module

02

= Outline type

HB

= Circuit configuration code (see "circuit options" - front page)

260

= Nominal average current rating at T

12

= V

Examples:

MP02 HB260-12

MP02 G260-16

MP02 GN260-10

Note: Prefered type is HB configuration. G & GN types are available for specific applications, only when requested.

Adequate heatsinking is required to maintain the base

temperature at 75

Power dissipation may be calculated by use of V

information in accordance with standard formulae. We can

provide assistance with calculations or choice of heatsink

if required.

The heatsink surface must be smooth and flat; a surface

finish of N6 (32

µin) and a flatness within 0.05mm (0.002")

are recommended.

Immediately prior to mounting, the heatsink surface should

be lightly scrubbed with fine emery, Scotch Brite or a mild

chemical etchant and then cleaned with a solvent to

remove oxide build up and foreign material. Care should

be taken to ensure no foreign particles remain.

An even coating of thermal compound (eg. Unial) should be

applied to both the heatsink and module mounting surfaces.

This should ideally be 0.05mm (0.002") per surface to

ensure optimum thermal performance.

After application of thermal compound, place the module

squarely over the mounting holes, (or 'T' slots) in the

heatsink. Using a torque wrench, slowly tighten the

recommended fixing bolts at each end, rotating each in turn

no more than 1/4 of a revolution at a time. Continue until the

required torque of 6Nm (55lb.ins) is reached at both ends.

It is not acceptable to fully tighten one fixing bolt before

starting to tighten the others. Such action may DAMAGE the

module.

ORDERING INSTRUCTIONS

MOUNTING RECOMMENDATIONS