6 - 14 GHz

Rev. V2

MASW-011021

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

4

Control Level

(DC Currents and Voltages)

B1

B2

J1-J2

J1-J3

-30 V

+30 mA

Low Loss

Isolation

+30 mA

-30 V

Isolation

Low Loss

Condition of

RF Output

Driver Connections

Bias Control

Optimal operation is achieved by simultaneous

application of negative DC voltage to the low loss

switching arm and positive DC current to the

isolating switching arm.

In the low loss state, the diode is reverse biased with

voltage. In the isolated state, the shunt diode is

forward biased with current.

Minimum Reverse Bias Required:

At X-Band, with a 1:1 match, 5V of negative reverse

bias is required. With a 4:1 match, 10 V of negative

However M/A-COM Technology Solutions suggests

a reverse bias voltage of –30V to achieve optimal

insertion loss.

8. R. Caverly and G. Hiller, “Establishing the Minimum Reverse

Bias for a P-I-N Diode in a High Power Switch,” IEEE

Transactions on Microwave Theory and Techniques, Vol.38,

No.12, December 1990

Handling Procedures

Attachment to a circuit board is made simple

through the use of standard surface mount technol-

ogy. Mounting pads are conveniently located on

the bottom surface of these devices and are re-

moved from the active junction locations. These

devices are well suited for solder attachment onto

hard and soft substrates. The use of 80Au/20Sn, or

RoHS compliant solders is recommended. For ap-

plications where the average power is ≤ 1W, con-

ductive silver epoxy may also be used. Cure per

manufacturers recommended time and tempera-

ture. Typically 1 hour at 150°C.

When soldering these devices to a hard substrate,

a solder re-flow method is preferred. A vacuum tip

pick-up tool and a force of 60 to100 grams applied

to the top surface of the device while placing the

chip is recommended. When soldering to soft sub-

strates, such as Duroid, it is recommended to use a

soft solder at the circuit board to mounting pad in-

terface to minimize stress due to any TCE mis-

matches that may exist. Position the die so that its

mounting pads are aligned with the circuit board

mounting pads. Solder reflow should not be per-

formed by causing heat to flow through the top sur-

face of the die to the back. Since the HMIC glass is

transparent, the edges of the mounting pads can

be visually inspected through the die after attach-

ment is completed.

Typical re-flow profiles for Sn60/Pb40 and RoHS

viewed on the MA-COM Technology Solutions

Sample Board

Samples test boards are available upon request