Bending test

Less than ±(0.5%+0.05Ω)of the initial value 50mΩ Max

3mm of bending shall be applied

No evidence of mechanical damage

for 5sec.

Adhesive strength

No mechanical damage or sign of disconnection

Test strengh : 5N

of termination

Test time: Applying pressure for 10seconds

Resistance to

Less than ±(1%+0.05Ω)of the initial value

50mΩ Max

260±5℃ , 10 sec

soldering heat

No evidence of mechanical damage

Anti-Vibration

Less than ±(1%+0.05Ω)of the initial value

50mΩ Max

Test amplitude : 1.5mm

test

No evidence of mechanical damage

Frequency 10㎐-55㎐-10㎐ / 2hr in x,y,z direction.

Temperature

Less than ±(1%+0.1Ω)of the initial value

50mΩ Max

100cycles, -55℃/30min ↔125℃/30min

cycle

No evidence of mechanical damage

sweep time:5min

Load life

Less than ±(3%+0.1Ω)of the initial value

50mΩ Max

Test voltage: rated voltage / 70±2℃

No evidence of mechanical damage

1,000hours(90min:On , 30min:Off)

Low Temp.

Less than ±(3%+0.1Ω)of the initial value

50mΩ Max

Dwell in -55℃ chamber without loading

Exposure

No evidence of mechanical damage

for 1,000hours

High Temp

Less than ±(3%+0.1Ω)of the initial value

50mΩ Max

Dwel in 125℃ or 155℃ chamber without loading

Exposure

No evidence of mechanical damage

for 1,000hours

Moisture

Less than ±(3%+0.1Ω)of the initial value

50mΩ Max

Test voltage: rated voltage / 40±2℃

Resistance

No evidence of mechanical damage

1,000hours(90min:On,30min:Off) / 90~95% RH

C. Recommended Soldering method :

Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )

* For the more detail Specification, Please refer to the samsung chip RESISTOR catalogue.

Judgement

Test condition