PGND

AGND

COMP

SS

FB

L = 4.7 é

H

Battery or

Power Source

Pull high for TORCH

Pull high for FLASH

VIN

SW

VOUT

EN

LM4510

50Ö

12.4Ö

10 é

F

4.7 é

F

10 nF

46.6k

2.2 nF

Everlight

47-23UWD/TR8

=

]

A

[

]

A

[

=

R

//

R

F

T

LM4510

SNVS533C – SEPTEMBER 2007 – REVISED MAY 2013

www.ti.com

connections that can inject noise into the system. The ground connection for the voltage-sensing resistor

should be connected directly to the AGND pin.

4. Trace connections made to the inductor should be minimized to reduce power dissipation, EMI radiation and

increase overall efficiency. Also poor trace connection increases the ripple of SW.

6. The AGND pin should connect directly to the ground. Not connecting the AGND pin directly, as close to the

chip as possible, may affect the performance of the LM4510 and limit its current driving capability. AGND

and PGND should be separate planes and should be connected at a single point.

7. For better thermal performance, DAP should be connected to ground, but cannot be used as the primary

ground connection. The PC board land may be modified to a "dog bone" shape to reduce SON thermal

impedance. For detail information, refer to Application Note AN-1187.

FLASH/TORCH APPLICATION

LM4510 can be configured to drive white LEDs for the flash and torch functions. The flash/torch can be set up

determine the current in Flash Mode. The amount of current can be estimated using the following equations:

(11)

Figure 29. Flash/Torch Circuit Using LM4510

16

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