数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

RC2012 数据表(PDF) 2 Page - Samsung semiconductor

部件名 RC2012
功能描述  Passive components sales offices
PDF  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  SAMSUNG [Samsung semiconductor]
网页  http://www.samsung.com/Products/Semiconductor
标志 SAMSUNG - Samsung semiconductor

RC2012 数据表(HTML) 2 Page - Samsung semiconductor

  RC2012 Datasheet HTML 1Page - Samsung semiconductor RC2012 Datasheet HTML 2Page - Samsung semiconductor RC2012 Datasheet HTML 3Page - Samsung semiconductor RC2012 Datasheet HTML 4Page - Samsung semiconductor RC2012 Datasheet HTML 5Page - Samsung semiconductor RC2012 Datasheet HTML 6Page - Samsung semiconductor RC2012 Datasheet HTML 7Page - Samsung semiconductor RC2012 Datasheet HTML 8Page - Samsung semiconductor RC2012 Datasheet HTML 9Page - Samsung semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 2 / 20 page
background image
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
CONTENTS
Operation Notes
Example of Land Pattern Design
Recommended Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms(RUT Series)
Ultra Low Ohms(RU Series)
Ultra Low Ohms(RUK Series)
Ultra Low Ohms(RJ Series)
Arrays(CONVEX Type)
Arrays(CONCAVE Type)
Arrays(FLAT Type)
Anti-Sulfur Resistors
Attenuator
Characteristics Performance
Packaging
Standard Resistance Value
We, Samsung, declare that our component Chip Resistor is produced in accordance
with EU RoHS directive.
1. RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
2. No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com, http://www.semlcr.com]
4
5
6
8
7
10
12
14
16
18
20
22
24
26
28
30
32
34
36



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com