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NFCC-NFHC 数据表(PDF) 4 Page - NIC-Components Corp.

部件名 NFCC-NFHC
功能描述  Surface Mount Fuse
PDF  5 Pages
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制造商  NIC [NIC-Components Corp.]
网页  http://www.niccomp.com
标志 NIC - NIC-Components Corp.

NFCC-NFHC 数据表(HTML) 4 Page - NIC-Components Corp.

  NFCC-NFHC Datasheet HTML 1Page - NIC-Components Corp. NFCC-NFHC Datasheet HTML 2Page - NIC-Components Corp. NFCC-NFHC Datasheet HTML 3Page - NIC-Components Corp. NFCC-NFHC Datasheet HTML 4Page - NIC-Components Corp. NFCC-NFHC Datasheet HTML 5Page - NIC-Components Corp.  
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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Item
Specification
Test Method
Surface Temperature Rise
75°C
Ambient Temperature: 10°C ~ 30°C
Applied Current: Rated Current
Current Capability
No fusing
Rated Current x 110% @ 70°C ± 2°C for 1 hr
Working Temperature Range
-55°C ~ +125°C
-
Time/Current Characteristic
See Available Values and Ratings Tables
Option Code
AD
Rated Current x 250%
Pre-acting time 5 sec. max.
Test current shall be applied continuously to the fuse
mounted on the test substrate
AB
Rated Current x 200%
Pre-acting time 5 sec. max.
Bending Strenght
No Visible Damage
Internal Resistance Change ±3% (AD, AB)
JIS C0051:1994 7.4.1
On the test substrate bending value is 3mm
for 10 ±1 sec.
Solderability
At least 95% coverage of the terminal surface
JIS C0054:1994
Immersion into solder at 235C ±5°C for 2 ± 0.5 secs.
Resistance to Soldering Heat
No Visible Damage
Internal resistance range ±10% max.
Immersion into solder at 260°C for 10 sec.
Reflow Soldering
1. Pre-heating: 150°C ±5°C, 120 sec. max.
2. T max. 240°C ±5°C, 10 sec. max, 2 passes
Endurance (Load Life)
Within 10% of voltage drop
At normal ambient temperature & RH on the test
substrate
Rated Current x 1.05, 1 hour "ON", 1/4 hour "OFF",
100 cycles
Rated current x 1.25 for 1 hour
Surface Mount Fuse
NFCC & NFHC Series
RECOMMENDED REFLOW PROFILE
Peak Temperature
(245°C for 5 sec.)
50
100
150
200
250
300
Time
Pre-heat
150°C ~ 180°C 120 sec. max.
25
0
Cool Down
Time above 220°C
30 sec. max.
Case Size
Reflow Soldering
Flow Soldering
A
B
CD
A
B
CD
0402
0.5
1.3
0.5
0.4
N/A
0603
1.0
2.0
0.8
0.5
1.0
2.6
0.8
0.8
0805
1.3
2.7
1.25
0.7
1.3
3.1
1.25
0.9
1206
2.2
3.9
1.6
0.85
2.2
4.3
1.6
1.05
A
B
D
C
D
RECOMMENDED FLOW PROFILE
Peak Temperature
(245°C ~ 250°C)
50
100
150
200
250
300
Time
Pre-heat
110°C ~ 130°C 120 sec. max.
25
0
Cool Down
Note: 0402 Reflow Only
Recommended Land Pattern Dimensions (mm)
FUSING TIME CURRENT CHARACTERISTICS
(see website: www.niccomp.com/catalog/fusingcharacteristics.pdf)



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