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NCSS12-R007TRF 数据表(PDF) 5 Page - NIC-Components Corp. |
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NCSS12-R007TRF 数据表(HTML) 5 Page - NIC-Components Corp. |
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5 / 6 page ![]() 5 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com SPECIFICATIONS ARE SUBJECT TO CHANGE Case Size A B C 0805 1.2 3.5 1.15 RECOMMENDED LAND PATTERN DIM. (mm) Current Sensing Chip Resistors NCSS Series B A C Case Size A B C 1206 1m Ω 1.0 2.3 1.8 2m Ω ~ 30mΩ 1.6 1.7 1.8 2010 3.5 1.5 3,4 2512 1m Ω ~ 3mΩ 1.3 3.1 4.0 4m Ω ~ 50mΩ 4.1 2.1 4.0 RECOMMENDED LAND PATTERN DIM. (mm) BA C B Sensing Trace RECOMMENDED REFLOW SOLDERING TEMPERATURE PROFILE 200 300 250 50 150 100 0 150°C ~ 180°C 120 Sec. 10 sec. Peak Temperature 260°C 230°C, 40 sec. max. |
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