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BMM150 数据表(PDF) 45 Page - List of Unclassifed Manufacturers |
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BMM150 数据表(HTML) 45 Page - List of Unclassifed Manufacturers |
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45 / 56 page ![]() Datasheet BMM150 Geomagnetic Sensor Page 45 BST-BMM150-DS001-01 | Revision 1.0 | April 2013 Bosch Sensortec © Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany. Note: Specifications within this document are subject to change without notice. 8. Package Original drawing? 8.1 Outline dimensions The sensor housing is 12 pin chip scale wafer level package (1.56 × 1.56 × 0.6 mm3). Its dimensions are the following: Figure 20: Package outline dimensions in µm Bottom view (Bumps visible) TOP view (Bumps not visible) Side view 400 195 A1 corner 566 283 283 283 283 VDD GND CSB SDI GND SCK INT VDDIO GND SDO PS DRY 1560 ± 30 1 2 3 4 5 A B C D E 566 283 283 283 283 VDD GND CSB SDI GND SCK INT VDDIO GND SDO PS DRY 1560 ± 30 5 4 3 2 1 A B C D E A1 corner 35 |
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