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STM706P2 数据表(PDF) 21 Page - STMicroelectronics |
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STM706P2 数据表(HTML) 21 Page - STMicroelectronics |
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21 / 32 page ![]() STM706T/S/R, STM706P, STM708T/S/R Maximum ratings Doc ID 10518 Rev 12 21/32 5 Maximum ratings Stressing the device above the rating listed in the Table 4: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in Table 5: Operating and AC measurement conditions of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature (VCC off) –55 to 150 °C TSLD (1) 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Lead solder temperature for 10 seconds 260 °C VIO (2) 2. Negative undershoot of –1.5 V for up to 10 ns or positive overshoot of VCC + 1.5 V for up to 10 ns is allowable on the WDI and MR input pins. Input or output voltage –0.3 to VCC +0.3 V VCC Supply voltage –0.3 to 7.0 V IO Output current 20 mA PD Power dissipation 320 mW |
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