@25°C

@25°C

Typ.

Current

Time

R1max

(Vdc)

(A)

(A)

(A)

(W)

(A)

(Sec)

(Ω)

(Ω)

DSM010

1

15.0

40

0.10

0.30

0.5

0.5

1.00

0.900

6.000

DSM020

2

9.0

40

0.20

0.50

0.5

1.0

0.60

0.550

3.500

DSM025

2

9.0

40

0.25

0.55

0.5

8.0

0.08

0.500

3.000

DSM035

3

6.0

40

0.35

0.75

0.5

8.0

0.10

0.200

1.400

DSM050

5

6.0

40

0.50

1.00

0.5

8.0

0.10

0.100

0.800

DSM075

7

6.0

40

0.75

1.40

0.5

8.0

0.10

0.060

0.450

DSM100

0

6.0

40

1.00

2.00

0.5

8.0

0.10

0.040

0.300

Ihold = Hold Current. Maximum current device will not trip in 25°C still air.

Itrip

= Trip Current. Minimum current at which the device will always trip in 25°C still air.

Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).

Imax

= Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd

= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.

CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

-40°C

-20°C

0°C

25°C

40°C

50°C

60°C

70°C

85°C

DSM010

0.13

0.12

0.11

0.10

0.08

0.07

0.06

0.05

0.03

DSM020

0.27

0.25

0.23

0.20

0.17

0.14

0.12

0.10

0.07

DSM025

0.32

0.29

0.27

0.25

0.21

0.18

0.16

0.05

0.03

DSM035

0.47

0.41

0.38

0.35

0.29

0.26

0.24

0.20

0.14

DSM050

0.67

0.59

0.54

0.50

0.41

0.37

0.34

0.29

0.20

DSM075

0.98

0.85

0.81

0.75

0.60

0.54

0.44

0.40

0.31

DSM100

1.30

1.12

1.08

1.00

0.80

0.72

0.58

0.53

0.42

Thermal Derating Curve

Typical Time-To-Trip At 25°C

Recommended Solder Reflow Conditions

Soldering

‧

Recommended reflow methods：IR, vapor phase oven, hot air oven.

‧

Devices are not designed to be wave soldered to the bottom side

of the board.

‧

Recommended maximum paste thickness is 0.25 mm (0.010 inch).

‧

Devices can be cleaned using standard method and solvents.

Note：If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

Packaging Information

Model

Model

Marking

Maximum

Time To Trip

DSM010-100

5,000 pcs/reel

Electrical characteristics(25℃)

Ihold verus tempetature

Preheating

Cooling

Resistance

Average Time Current Curves

0.001

0.01

0.1

1

10

100

0.1

1

10

Current In Amperes

0.10A

0.20A

0.25A

0.35A

0.50A

0.75A

1.00A

Derating Curves for SMD0603 Series

0

20

40

60

80

100

120

140

160

-40

-20

0

20

40

60

80

Temperature (°C)

300

200

160

250

190

100

60-120 sec.

0

120 sec.

30~60sec.

PPTC/DSM Series

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Reel:

REV.2014.05.01