Product Specification

PE4308

Page 2 of 11

©2003-2006 Peregrine Semiconductor Corp. All rights reserved.

Document No. 70-0162-04

│ UltraCMOS™ RFIC Solutions

Table 2. Pin Descriptions

Electrostatic Discharge (ESD) Precautions

When handling this UltraCMOS™ device, observe

the same precautions that you would use with other

ESD-sensitive devices. Although this device

contains circuitry to protect it from damage due to

ESD, precautions should be taken to avoid

exceeding the rate specified in Table 3.

Exposed Solder Pad Connection

The exposed solder pad on the bottom of the

package must be grounded for proper device

operation.

external series capacitor.

2: Latch Enable (LE) has an internal 100 k

Ωresistor to V

DD.

3: Connect pin 12 to GND to enable internal negative voltage

disable internal negative voltage generator.

4. Place a 10 k

Ωresistor in series, as close to pin as possible

to avoid frequency resonance. See “Resistor on Pin 1 & 3”

paragraph

Figure 14. Pin Configuration (Top View)

Latch-Up Avoidance

Unlike conventional CMOS devices, UltraCMOS™

devices are immune to latch-up.

Switching Frequency

The PE4308 has a maximum 25 kHz switching rate.

Resistor on Pin 1 & 3

A 10 k

Ω resistor on the inputs to Pin 1 & 3 (see

Figure 5) will eliminate package resonance between

the RF input pin and the two digital inputs. Specified

attenuation error versus frequency performance is

dependent upon this condition.

1

15

14

13

12

11

2

3

4

5

C16

RF1

Data

Clock

LE

GND

Vss/GND

P/S

RF2

C8

20-lead

QFN

4x4mm

Exposed Solder Pad

Pin

No.

Pin

Name

Description

1

C16

Attenuation control bit, 16dB (Note 4).

2

RF1

RF port (Note 1).

3

Data

Serial interface data input (Note 4).

4

Clock

Serial interface clock input.

5

LE

Latch Enable input (Note 2).

6

Power supply pin.

7

PUP1

Power-up selection bit.

8

PUP2

Power-up selection bit.

9

Power supply pin.

10

GND

Ground connection.

11

GND

Ground connection.

12

Negative supply voltage or GND

connection (Note 3)

13

P/S

Parallel/Serial mode select.

14

RF2

RF port (Note 1).

15

C8

Attenuation control bit, 8 dB.

16

C4

Attenuation control bit, 4 dB.

17

C2

Attenuation control bit, 2 dB.

18

GND

Ground connection.

19

C1

Attenuation control bit, 1 dB.

20

N/C

No connect

Paddle

GND

Ground for proper operation

Table 3. Absolute Maximum Ratings

Table 4. Operating Ranges

Symbol

Parameter/Conditions

Min

Max

Units

Power supply voltage

-0.3

4.0

V

Voltage on any input

-0.3

0.3

V

Storage temperature range

-65

150

°C

P

IN

Input power (50

Ω)

+30

dBm

ESD voltage (Human Body

Model)

500

V

Parameter

Min

Typ

Max

Units

Voltage

2.7

3.0

3.3

V

Current

100

µA

Digital Input High

V

Digital Input Low

V

Digital Input Leakage

1

µA

Input Power

+24

dBm

Temperature range

-40

85

°C