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SM4T68AY 数据表(PDF) 4 Page - STMicroelectronics

部件名 SM4T68AY
功能描述  Automotive 400 W Transil
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

SM4T68AY 数据表(HTML) 4 Page - STMicroelectronics

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Characteristics
SM4TY
4/12
Doc ID 17862 Rev 3
Figure 3.
Peak pulse power dissipation
versus initial junction temperature
Figure 4.
Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
0
100
200
300
400
500
0
25
50
75
100
125
150
175
P (W)
PP
T (°C)
j
Pulse = 10/1000 µs
0.1
1.0
10.0
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
P (kW)
PP
tp(ms)
Figure 5.
Clamping voltage versus peak
pulse current (exponential
waveform, maximum values)
Figure 6.
Junction capacitance versus
reverse applied voltage for
unidirectional types (typical values)
I (A)
PP
0.1
1.0
10.0
100.0
1000.0
1
10
100
1000
10/1000 µs
8/20 µs
V (V)
CL
T initial = 25 °C
j
C(pF)
10
100
1000
10000
1
10
100
1000
SM4T6V7AY
SM4T30AY
SM4T82AY
V (V)
R
F = 1 Mhz
V
= 30 mV
T = 25 °C
OSC
RMS
j
Figure 7.
Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
Figure 8.
Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
C(pF)
10
100
1000
10000
1
10
100
1000
SM4T6V7CAY
SM4T30CAY
SM4T82CAY
V (V)
R
F = 1 Mhz
V
= 30 mV
T = 25 °C
OSC
RMS
j
0.01
0.10
1.00
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Recommended pad layout
Z/R
th(j-a)
th(j-a)
tp(s)
Printed circuit board FR4,
copper thickness = 35 µm



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