HCPL-0701 datasheet(2/14 Pages) AVAGO

2 / 14 page

Selection for lower input current down to 250 μA is

available upon request.

The HCPL-0701 and HCPL-0700 are surface mount devices

packaged in an industry standard SOIC-8 footprint.

The SOIC-8 does not require “through holes” in a PCB.

This package occupies approximately one-third the

footprint area of the standard dual-in-line package. The

lead profile is designed to be compatible with standard

surface mount processes.

The HCNW139 and HCNW138 are packaged in a

widebody encapsulation that provides creepage and

clearance dimensions suitable for safety approval by

regulatory agencies worldwide.

Selection Guide

Widebody

8-Pin DIP

Package

Hermetic

(300 Mil)

Small Outline SO-8

(400 mil)

Single and

Dual

Single

Dual

Minimum

Absolute

Dual

Single

Channel

Single

Input ON

Maxi-

Channel

Package

Channel

Current

Minimum

mum

Packages

Package

HCPL-

Package

CTR

HCPL-

6N139

2731[1]

0701

0731

HCNW139

0.5 mA

400%

18 V

6N138

2730[1]

0700

0730

HCNW138

1.6 mA

300%

7 V

HCPL-4701[1]

4731[1]

070A[1]

073A[1]

40 μA

800%

18 V

0.5 mA

300%

20 V

5701[1]

5700[1]

5731[1]

5730[1]

Note:

1. Technical data are on separate Avago publications.

HCPL-0701 数据表(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED

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